I'm sure great things are happening in the field, and many wonderful ideas and discoveries have been made — but statements such as "take us past Moores law" requires manufacturing, and I haven't seen anything to say that this is possible albeit I am ever hopeful for the day that it is.
I thought Aluminium and titanium were used in the lower interconnect layers, but according to [1] you are right.
The tech mentioned in the article is supposedly useful for transistors, not necessarily interconnect though. I guess that would be useful for going beyond planar processes. But at some point our current architectures are already severely limited regarding TDP anyway, so unless you can afford using only 10% of your chips, an architecture revolution is overdue IMO.
[1] https://en.wikipedia.org/wiki/Interconnect_(integrated_circu...
As in: Moore's law is still giving you more transistors, but you can't actually turn them all on, and they aren't getting faster, so no free lunch.
(Which of course is why the Apple M1 is so significantly ahead, at least of Intel)
