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0 pointscolechristensen4y ago0 comments

They take up chip fab capacity and that’s the bottleneck. The fact that it would be a custom die doesn’t really make a difference (and high level the features that go on the chip aren’t really all that different either, same stuff with various quantities and features tweaked)

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terafo4y ago

They take up chip capacity on different fab. You can't produce gaming Ampere on TSMC. They are built on different architectures that have only name in common. The difference between "Ampere" and "Ampere" is bigger than between Volta and Turing, or maybe even than difference between Pascal and Turing.

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0 pointscolechristensen4y ago0 comments

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terafo4y ago

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