And for reference there's a section in this BBC film about how it was done in the 1970s, by hand: https://www.bbc.co.uk/programmes/p01z4rrj

Bond wires really are a thing of the past now except in niche applications or legacy chips. Flip chip designs have the die directly interface with a substrate that is then soldered to the board. With the kinds of speedy signals modern chips use, bond wires introduce impedance mismatch that degrades quality. This is related to why you don't see many new designs using pins.